PCB welding process

PCB board welding process

1. PCB board welding process

1.1 PCB board welding process introduced

PCB board welding process required manual plug-in, manual welding, repair and inspection.

1.2 PCB board welding process

Sort components by list - Add-ons - Welding - Cut toe - Check - Trim.

2. PCB board welding process requirements

2.1 components processing requirements of the process

2.1.1 components Before insertion, the solderability of the components must be dealt with, if the poor solderability of the first component pin plating

tin.

2.1.2 component pin plastic, the pin spacing requirements and PCB board corresponding pad hole spacing consistent.

2.1.3 Components The shape of the pins should be conducive to heat dissipation and mechanical strength after soldering.

2.2 components in the PCB board process requirements

2.2.1 components in the PCB board assembly sequence is the first low after the high, the first small, the first light and heavy, the first easy after the hard, first general components

Special components, and after the procedure on the installation process can not affect the next installation.

2.2.2 After components are inserted, their markings shall be read in an easy-to-read direction and read from left to right as far as possible.

2.2.3 polar components polarity should be strictly in accordance with the requirements of the drawings installed, can not be wrong.

2.2.4 Components on the PCB board should be evenly distributed cartridge, arranged neatly beautiful, do not allow oblique row, three-dimensional cross and overlapped arrangement;

Do not allow one side is high, while the other side is low; also do not allow the pin side of the long, short side.

2.3 PCB board solder joint process requirements

2.3.1 The mechanical strength of solder joints should be sufficient

2.3.2 reliable welding, to ensure electrical conductivity

2.3.3 solder joint surface to be smooth and clean

3. PCB board welding process of static protection

3.1 electrostatic protection principle

3.1.1 Where possible static electricity to prevent the accumulation of static electricity, to take measures to control within the safe range.

3.1.2 The existing accumulation of static electricity should be quickly eliminated, immediate release.

3.2 Electrostatic protection methods

3.2.1 Leakage and grounding. Ground the site where static electricity may have occurred or have been generated to provide an ESD path. Buried line

Method of establishing "independent" ground.

3.2.2 Elimination of non-conductor belt static electricity: Generate positive and negative ions with the ion fan to neutralize static electricity static electricity