BGA maintenance skills

BGA maintenance skills

 SUNKKO 852B parameters of the state is set to: temperature 280 ℃ ~ 310 ℃; untwisting time: 15 seconds; Merry flow parameters: × × × (1 ~ 9 files can be preset by the user code);

     Finally, the disassembler will be set to automatic mode, SUNKKO 202 BGA anti-static tin repair station, with a top ten universal mobile phone PCB board installed and fixed on the maintenance stage.

 

Before soldering, remember the direction and orientation of the chip. If there is no printed positioning frame on the PCB, draw a small amount of flux on the bottom of the BGA with a marker pen, and select a suitable BGA soldering nozzle suitable for soldering the BGA size 852B,

     The handle vertical alignment BGA, but note that the nozzle must leave the component about 4mm, press the 852B handle on the start button, the desoldering device will be preset parameters for automatic desoldering.

 

     Soldering after 2 seconds after the end of the suction pen with the BGA components removed, so that the original solder ball can be evenly divided in the PCB and BGA pads, the benefit is to facilitate the continued BGA welding. If there is PCB solder joint with more than Tin, the anti-static soldering station to deal with uniform and severe connection, you can apply a flux on the PCB, 852B again on the PCB heating, the final neat tin package smooth. Through the anti-static soldering station with a suction tin BGA on the fully sucked off the tin. Pay attention to anti-static and do not over-temperature, otherwise it will destroy the pad or motherboard.