Layout wiring reference
1.IC: U * transistor: Q * single resistor: R * OSCILLATOR: OSC *
Capacitance: C * SIP Pai: RA * Variable resistance: VR * CRYSTAL: X *
Inductance: L * DIP Exclusion: RP * Variable Capacitance: VC * CONNECTOR: J *
Battery: BT * JUMPER: JP * SPEAKER: BZ * DIODE ARRAY: DA *
FUSE: F * Diode: D * Transformer: T * SWITCH: SW * DIP FILTER: DF *
2. REFERENCE DESIGNATOR order: from top to bottom, from left to right, each part number is listed.
Parts surface: from No. 1, such as U1, C1, U2, C2 ... Solder surface: from No. 501, such as U501, C501, U502, C502 ...
3. The difference between the diameter of circular PAD (or the length of square PAD) and the median diameter should be at least 16 mils or more.
4. PAD generally use a round, but the following situation should be used square PAD, to facilitate identification:
(1) IC first leg.
(2). "+" End of the polar part.
(3). "K" end of DIODE.
(4). The "E" end of the transistor.
(5). The first leg of CONNECTOR.
(6). The first leg of 2-PIN and 3-PIN JUMPER.
(7). TEST-POINT.
(8). The first leg of OSCILLATTOR.
(9) Exclusion (SIP or DIP package) of the first leg.
(10) DIP SWITCH the first leg.
(11) DIP FILTER the first leg.
5. DIP type of IC, resistance, exclusion, DIODE and other parts drilling aperture of 37mil tin pad to 54mil.
6. Vertical parts (including capacitors, transistors) tin pad is 56mil drilling aperture of 39 mil.
7. ANTI-PAD: Insulation tin pad
Diameter <0.016 ", ANTI-PAD diameter should be greater than the diameter of more than 16mil.
Diameter ≧ 0.016 ", ANTI-PAD diameter should be greater than the diameter of more than 24mil.
Diameter ≧ 0.1 ", ANTI-PAD diameter should be greater than the diameter of more than 30mil.
Rectangular hole, ANTI-PAD also make a rectangle, each side should grow longer than the hole edge 30mil above;
(For continuous holes, the rectangular hole ANTI-PAD is also a continuous circle).
8. VIA HOLE 1 drilled hole diameter of 18mil tin pad is 30mil ANTI-PAD is 42mil.
VIA HOLE 2 hole diameter of 13mil tin pad is 25mil ANTI-PAD is 29mil.
9. VIA HOLE (usually laser drilled) with aperture less than 8 mils without THERMAL PAD.
The 0.1 / 4W resistor, 1/8 W resistor, and AXIAL TYPE pin pitch are specified at 0.5 "but in very dense conditions 0.4" pitch is allowed.
11. Common ceramic capacitor Pitch 0.2 ", Psilence Pitch 0.1".
12. The power line width according to engineering specifications, if not required, then at least 50mil width.
13. General line width 6mil spacing at least 5mil. Larger power circuit board at least 8mil away from time.
14. The signal line at least 25mil from the edge of the board, if there is broken edge, the line from the edge of the stamp hole is also broken at least 25mil, wide tin from the edge of the plate at least 20mil.
15. Any kind of board with a minimum of 15 mils from the edge of the Non-PTH hole with no PAD.
16. Any SOLDER MASK PAD is at least 6 mil larger than the SOLDER PAD itself.
17. Text surface symbols, graphics and text lines width 6 ~ 10mil. Size is 70x55mil + -15mil.
18. The shape of each part conforms to the shape of the part and shall be clearly marked on the first leg.
19. Directional parts should be clearly marked foot or polarity.
★ Polar parts should be marked "+" at the positive end.
★ CONNECTOR should be marked around the foot number.
★ 3-PIN JUMPER should be marked 1 or 3 feet.
★ Gold fingers should be marked before and after the footer.
★ Diode do not have to mark the foot number, but the parts should be clear figure that the direction of polarity.
★ transistor should be marked with the pin.
★ POWER CONNECTOR should indicate the power of each pin name and the front and rear foot number.
★ QFP, PLCC, PGA and other four sides of the PIN parts, should be marked on each corner of the foot number.
★ 100PIN QFP above PIN10, PIN20, PIN30, PIN40 ⋯⋯, etc., every 10PIN
For a short-term (length 40mil or so), to facilitate the foot count.
20. Text, symbols, graphics can not touch the parts foot PAD, VIA PAD try not to touch the fuse (FUSE) must add RATED VOLTAGE, RATED CURRENT and FUSETYPE, the most commonly used are: FUSE 125V F5A.
21. SMC board, the wire and PAD connection Fang shows.
22. Turn TRACE to avoid sharp corners when cornering.
Capacitance: C * SIP Pai: RA * Variable resistance: VR * CRYSTAL: X *
Inductance: L * DIP Exclusion: RP * Variable Capacitance: VC * CONNECTOR: J *
Battery: BT * JUMPER: JP * SPEAKER: BZ * DIODE ARRAY: DA *
FUSE: F * Diode: D * Transformer: T * SWITCH: SW * DIP FILTER: DF *
2. REFERENCE DESIGNATOR order: from top to bottom, from left to right, each part number is listed.
Parts surface: from No. 1, such as U1, C1, U2, C2 ... Solder surface: from No. 501, such as U501, C501, U502, C502 ...
3. The difference between the diameter of circular PAD (or the length of square PAD) and the median diameter should be at least 16 mils or more.
4. PAD generally use a round, but the following situation should be used square PAD, to facilitate identification:
(1) IC first leg.
(2). "+" End of the polar part.
(3). "K" end of DIODE.
(4). The "E" end of the transistor.
(5). The first leg of CONNECTOR.
(6). The first leg of 2-PIN and 3-PIN JUMPER.
(7). TEST-POINT.
(8). The first leg of OSCILLATTOR.
(9) Exclusion (SIP or DIP package) of the first leg.
(10) DIP SWITCH the first leg.
(11) DIP FILTER the first leg.
5. DIP type of IC, resistance, exclusion, DIODE and other parts drilling aperture of 37mil tin pad to 54mil.
6. Vertical parts (including capacitors, transistors) tin pad is 56mil drilling aperture of 39 mil.
7. ANTI-PAD: Insulation tin pad
Diameter <0.016 ", ANTI-PAD diameter should be greater than the diameter of more than 16mil.
Diameter ≧ 0.016 ", ANTI-PAD diameter should be greater than the diameter of more than 24mil.
Diameter ≧ 0.1 ", ANTI-PAD diameter should be greater than the diameter of more than 30mil.
Rectangular hole, ANTI-PAD also make a rectangle, each side should grow longer than the hole edge 30mil above;
(For continuous holes, the rectangular hole ANTI-PAD is also a continuous circle).
8. VIA HOLE 1 drilled hole diameter of 18mil tin pad is 30mil ANTI-PAD is 42mil.
VIA HOLE 2 hole diameter of 13mil tin pad is 25mil ANTI-PAD is 29mil.
9. VIA HOLE (usually laser drilled) with aperture less than 8 mils without THERMAL PAD.
The 0.1 / 4W resistor, 1/8 W resistor, and AXIAL TYPE pin pitch are specified at 0.5 "but in very dense conditions 0.4" pitch is allowed.
11. Common ceramic capacitor Pitch 0.2 ", Psilence Pitch 0.1".
12. The power line width according to engineering specifications, if not required, then at least 50mil width.
13. General line width 6mil spacing at least 5mil. Larger power circuit board at least 8mil away from time.
14. The signal line at least 25mil from the edge of the board, if there is broken edge, the line from the edge of the stamp hole is also broken at least 25mil, wide tin from the edge of the plate at least 20mil.
15. Any kind of board with a minimum of 15 mils from the edge of the Non-PTH hole with no PAD.
16. Any SOLDER MASK PAD is at least 6 mil larger than the SOLDER PAD itself.
17. Text surface symbols, graphics and text lines width 6 ~ 10mil. Size is 70x55mil + -15mil.
18. The shape of each part conforms to the shape of the part and shall be clearly marked on the first leg.
19. Directional parts should be clearly marked foot or polarity.
★ Polar parts should be marked "+" at the positive end.
★ CONNECTOR should be marked around the foot number.
★ 3-PIN JUMPER should be marked 1 or 3 feet.
★ Gold fingers should be marked before and after the footer.
★ Diode do not have to mark the foot number, but the parts should be clear figure that the direction of polarity.
★ transistor should be marked with the pin.
★ POWER CONNECTOR should indicate the power of each pin name and the front and rear foot number.
★ QFP, PLCC, PGA and other four sides of the PIN parts, should be marked on each corner of the foot number.
★ 100PIN QFP above PIN10, PIN20, PIN30, PIN40 ⋯⋯, etc., every 10PIN
For a short-term (length 40mil or so), to facilitate the foot count.
20. Text, symbols, graphics can not touch the parts foot PAD, VIA PAD try not to touch the fuse (FUSE) must add RATED VOLTAGE, RATED CURRENT and FUSETYPE, the most commonly used are: FUSE 125V F5A.
21. SMC board, the wire and PAD connection Fang shows.
22. Turn TRACE to avoid sharp corners when cornering.