SMT焊接基本工艺由哪些要素组成

SMT welding process consists of the basic elements

Silkscreen: Its role is to solder paste or patch glue printed on the PCB pad, in preparation for the welding components. Equipment used for screen printing machine (screen printing machine), located in the forefront of the SMT production line.

    Dispensing: It is the glue drops to the PCB's fixed position, its main role is to fix the components to the PCB board. The equipment used is a dispenser, located at the forefront of the SMT line or behind the test equipment.

    Placement: Its role is to accurately mount the surface mount components to a fixed position on the PCB. Equipment used for the placement machine, located in the SMT production line in the back of the screen printing machine.

    Curing: Its role is to melt the chip glue, so that the surface assembly of components and PCB firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT line.

    Reflow soldering: Its role is to melt the solder paste, so that the surface assembly of components and PCB firmly bonded together. The equipment used is a reflow oven located on the back of the SMT machine in the placement machine.

Cleaning: Its role is to be assembled on the PCB board harmful to the human body, such as welding residues removed flux. Equipment used for washing machines, the location can not be fixed, can be online or offline.

    Detection: Its role is to assemble the PCB board welding quality and assembly quality testing. Equipment used are magnifying glass, microscope, on-line tester (ICT), flying probe tester, automatic optical test (AOI), X-RAY test system, function tester. Location According to the testing needs, can be configured in the production line where appropriate.

    Rework: Its role is to detect the failure of the PCB rework. Tools used for the iron, rework station and so on. Configured anywhere in the production line.