Paste the use of attention points

Paste the use of attention points

Before and after a glue cycle, it is a good idea to drop at least two separate gel spots on the board to represent each point of the diameter. This allows the operator to compare the gel point quality during the recycle cycle. These points can also be used to survey the glue point diameter. Gel point detection tools are relatively inexpensive, basically portable or desktop survey eyepiece. I do not know if there is a special semi-automatic facility for spot check. A little AOI (automated optical inspection) machine can be debugged to do the job, but it may be done.

Check the glue. The dispensing of glue is another intricate process that can easily get out of the way of the desired final result. As with solder paste printing, there is a need for a process monitoring inspection strategy that is well-defined and properly implemented to maintain the process under control. It is recommended to check the glue dot diameter manually. Use the X-bar R chart to record the final result.

For most parts of the assembly line, especially for high mix production, the preferred mid-level performance, it is off-line, table top installation tools, surveying the cover plane or object surface size, thickness and size. These tools are flexible, costing less than $ 50,000, and generally provide the desired amount of feedback. Very surface and semi-automated tools are far more expensive ($ 75,000 - $ 200,000). However, they check the board faster, more convenient, because it is installed online. Most suitable for a large number of low-mix assembly line.

Solder paste inspection facilities have a simple 3X magnifying glass to extremely expensive semi-automatic online machine. Level 1 tools use optics or laser to measure thickness, while Level 2 tools use laser surveys to cover area, thickness and size. Both tools are used offline. Level 3 tools are also surveyed covering the area, thickness and size, but are installed online. The speed, precision and repeatability of these systems are different, depending on the price. The more expensive tools provide better performance.

Paste inspection. Solder paste printing is a complex process, it is easy to leave the right end of the desired results. There is a need for a process monitoring inspection strategy that is well-defined and properly implemented to maintain the process under control. At a minimum, man-made coverage and survey thickness should be covered, but semi-automatic surveys of cover, thickness and size are best used. Use the X-bar R chart to record the final result.

Semi-automated is surprisingly clever; in many things it is more accurate, prompt and rate-limiting than the ICSC. But it can be quite expensive, depending on how complicated it is. Semi-automated search facilities may diminish human awareness and give people a false sense of security.